PITA Fiscal Year 2007 Projects

Product and Process Design and Optimization

Development of a Novel Numerical Simulation Tool for Chemical Mechanical Polishing Device with Applications to Information Technology
Chemical mechanical polishing (CMP) technology has been developed to achieve adequate local and global planarization for the manufacturing of integrated circuit (IC) devices with multiple interconnection layers. Experimental measurements revealed that a sub-ambient slurry pressure between the wafer and the polishing pad could cause non-uniformity in material removal across the wafer since the polishing process is strongly dependent on the contact pressure. Therefore, accurate modeling of the hydrodynamic pressure and velocity profiles are vital to predict successful CMP performance.

To achieve this objective, we have been developing a novel numerical technique; lattice Boltzmann method (LBM), based on Boltzmann transport equation (BTE), which is computationally advantageous and contains a sound physical basis. This novel numerical tool will be suitable for simulating complex hydrodynamic systems involving lubricating fluid with suspended nanosized particles. Further, the numerical technique which we will develop during this project inherently possesses parallel, transient, and a rule-based nature, which can be seamlessly extended to high-performance computing platforms.