PITA FY2014 Projects

Application Of Nanotechnology To Adhesive Systems For High Temperature Use

PI:Ray Pearson, Materials Science and Engineering

University:Lehigh University

Co-PI(s):Masashi Watanabe, Materials Science and Engineering

Industry Affiliate(s):ElectroChemical Company

Summary:The goal of this project is to develop a room temperature cured epoxy-based adhesive for high temperature use. The epoxy should have sufficient fracture resistance and ductility to allow use in demanding engineering applications. The key technological enabler in the proposed work is the application of one or more nano-scale additives to an existing epoxy formulation, although modifying the existing epoxy resin such that the impact of the nanoscale modifier is also a possibility.